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H006********038
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模拟开关,ADG333ABRSZ,TSSOP20, ,美国 ADI,L,
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元器件
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600.0
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2
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H006********079
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集成电路,LT1361CS8#PBF,SO-8, , ADI(亚德诺),L,
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元器件
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300.0
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3
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H006********069
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芯片,AD825ARZ,SO-8, ,美国 ADI,L,
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元器件
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600.0
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4
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H006********732
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厚膜电阻, 0402WGF100JTCE,阻值:10Ω ,功率:62.5mW ,精度:±1% ,0402,最大工作电压:50V ,工作温度范围:-55℃~+155℃,L,温度系数:±200ppm/℃ ,
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元器件
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660.0
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5
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H006********924
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0402WGF1003TCE贴片电阻,res,100K,1/16W,+/-1%+/-1%,0402,L,0402WGF1003TCE贴片电阻res,100K,+/-1%,0402,1/16W0402贴片电阻器厚声0.001********902,
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元器件
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660.0
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6
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H006********925
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0402WGF1002TCE贴片电阻,res,10K,,1/16W,+/-1%,0402,厚声,L,0402WGF1002TCE贴片电阻res,10K,+/-1%,0402,1/16W0402贴片电阻器厚声0.001********502,
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元器件
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660.0
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个
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7
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H006********244
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厚膜电阻,51Ω,62.5mW,±1%,0402,0402WGF510JTCE,厚声,L,工作电压:50V 温度系数:±100ppm/℃,
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元器件
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660.0
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个
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8
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H006********396
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电阻,1kΩ,62.5mW,±0.1%,0402,TC0225B1001TCC,UNI-ROYAL(厚声),L,
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元器件
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990.0
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9
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H006********397
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电阻,383kΩ,62.5mW,±1%,0402,0402WGF3833TCE,UNI-ROYAL(厚声),L,
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元器件
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660.0
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10
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H006********535
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贴片电阻,7.5k,62.5mW,±0.1%,0402,RT0402BRD077K5L,YAGEO(国巨),L,
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元器件
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990.0
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个
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11
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H007********766
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电容,1uF,25V,0402,±10%,L,三星,X5R,CL05A105KA5NQNC,
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元器件
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660.0
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12
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H007********819
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电容,100nF,50V,0402,±10%,L,SAMSUNG(三星),X7R,CL05B104KB54PNC,
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元器件
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3300.0
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13
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H007********821
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电容,10pF,50V,0402,±5%,L,SAMSUNG(三星),C0G,CL05C100JB5NNNC,
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元器件
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660.0
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14
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H007********844
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电容,47pF,50V,0402,±5%,L,SAMSUNG(三星),C0G,CL05C470JB51PNC,
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元器件
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1320.0
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H008********010
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连接器,AFC05-S12FIA-00,JS(钜硕电子),SMD,P=0.5mm, , , ,L,锁定特性:翻盖式 触点类型:下接 触点数量:12P 间距:0.5mm 安装方式:卧贴,
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元器件
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330.0
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